JPH0135503B2 - - Google Patents

Info

Publication number
JPH0135503B2
JPH0135503B2 JP58064316A JP6431683A JPH0135503B2 JP H0135503 B2 JPH0135503 B2 JP H0135503B2 JP 58064316 A JP58064316 A JP 58064316A JP 6431683 A JP6431683 A JP 6431683A JP H0135503 B2 JPH0135503 B2 JP H0135503B2
Authority
JP
Japan
Prior art keywords
plating
lead frame
metal strip
lead
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58064316A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59188952A (ja
Inventor
Yukitomo Tsukada
Yoshiharu Koizumi
Tomoyuki Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP6431683A priority Critical patent/JPS59188952A/ja
Publication of JPS59188952A publication Critical patent/JPS59188952A/ja
Publication of JPH0135503B2 publication Critical patent/JPH0135503B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6431683A 1983-04-11 1983-04-11 リ−ドフレ−ムの製造方法 Granted JPS59188952A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6431683A JPS59188952A (ja) 1983-04-11 1983-04-11 リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6431683A JPS59188952A (ja) 1983-04-11 1983-04-11 リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS59188952A JPS59188952A (ja) 1984-10-26
JPH0135503B2 true JPH0135503B2 (en]) 1989-07-25

Family

ID=13254704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6431683A Granted JPS59188952A (ja) 1983-04-11 1983-04-11 リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS59188952A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9779966B2 (en) 2015-08-07 2017-10-03 Shinko Electric Industries Co., Ltd. Lead frame and semiconductor device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01153653U (en]) * 1988-04-01 1989-10-23
JPH0821663B2 (ja) * 1989-10-13 1996-03-04 株式会社三井ハイテック リードフレームの製造方法
JP5735352B2 (ja) * 2011-06-06 2015-06-17 新光電気工業株式会社 リードフレーム連結体、リードフレームの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137209A (ja) * 1982-02-09 1983-08-15 Mitsubishi Electric Corp 半導体装置の製造方法
JPS5999750A (ja) * 1982-11-30 1984-06-08 Sumitomo Metal Mining Co Ltd Ｉｃ用リ−ドフレ−ムの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9779966B2 (en) 2015-08-07 2017-10-03 Shinko Electric Industries Co., Ltd. Lead frame and semiconductor device

Also Published As

Publication number Publication date
JPS59188952A (ja) 1984-10-26

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